The 1500EXL- from
Heller's newest
generation of reflow
ovens- provides 25%
higher airflow for
enhanced temperature
uniformity, repeatability
and high-load handling.
The 1500EXL features
Heller's new, enlarged
heating tunnel and
baffle-free design, for
six-sigma consistency,
zone-to-zone and oven to oven. It also provides
more flexibility in board
handling, more robust
construction and a
more streamlined
appearance.
The 1500EXL supports
line speeds up to 28
inches (70 centimeters)
per minute, while
conserving valuable
factory floor space.
Rapid response times
and precise
temperature controls
assure process
uniformity, regardless
of component density
or board loading, with
identical profile
performance in either
air or nitrogen.
·The most efficient heat transfer, from extra high-volume,
high-velocity, heating modules, producing temperature
gradients of less than 2oC throughout the oven.
·Instant-response heating modules that react in less than one
second to temperature changes of less than 0.1oC to
maintain profile integrity for heavy board loads.
·Flux filtration system removes up to 95% of flux from the
atmosphere - processing boards in a flux-free environment.
·The lowest nitrogen consumption in the industry: 350
SCFH* with our Ultra Low option.
·Six-sigma reliability for the most demanding production
environments.
·Single or dual-rail
edge hold conveyor
for greater versatility
in board handling.
·User-friendly
WindowsTM
software.Alternate
curing configuration,
with topside IR
panels to create a
temperature
differential that
protects heatsensitive
components.
·An optional UV
module may be
added for UV cure
adhesives.
