The QSV-1 Plus Assembler is the perfect mainstream solution for automated SMT assembly operations. It combines fine pitch component placement technology, large-board capability, and 117 feeder capacity — all at an affordable price. The QSV-1 Plus features the same high-end touchless in-process optical component alignment technology that is available in all Q-Series assemblers.

The QSV-1 Plus also offers P4 head technology in a single gantry design for throughput rates up to 7,000 cph, as well as the ability to handle components from 0201's through 2.2”, and it manages to deliver these high-performance capabilities at a moderate cost. The QSV-1 Plus can stand alone or in-line with your chip shooter. It is the flexible, economical assembler for your SMT production requirements.

* Requires Optional ThinPRO Feeder

·Single gantry design provides placement rates up to 7,000 cph takt time
·Handles board sizes from 3.2" x 3" to 15" x 18" 
·In-process QuadAlign touchless centering from 0402 through QFP208 and BGA
·Quad's innovative P4 (Pick-Pick, Place-Place) head technology
·Exclusive QSOFT operating software with Windows ease of use
·Detachable feeder bases and carts for rapid changeover
·Noncontact linear encoders
·Programmable transport
·Optional Intelligent Feeder System for setup verification
·0.3mm ultra-fine pitch capable

• Quad Align
• QSV-1 Spec. Sheet (Full Version)

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