Quad QSA-30 Pick & Place

Quad QSA-30 Pick & Place

The QSA-30 Series consists of two CE-certified models; the QSA-30ATMand the QSA-30VTM.The QSA-30A utilizes Quad's proprietary QuadAlign™ in-process alignment technology to achieve high yield chip placement as well as placing IC components at high production speeds. The QSA-30V incorporates an upward vision camera that expands the component range to include ultra-fine pitch QFPs, in addition to full BGA ball inspection.

Quad QSA-30 Pick & Place Features:

  • Three head placement system
  • On the fly laser part alignment
  • Accurately places devices up to 25mm square
  • 13,000 components per hour
  • 450mm x 400mm Max PCB Size
  • Up to 76 8mm Feeders
  • Multiple Nozzles with Automatic Changers
  • Dimensions: 60.6" x 65.4" 2100 lbs.

Surface Mount Equipment

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